Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy 閱讀全文 »
FTIR spectroscopy as a tool for nano-material characterization 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming FTIR spectroscopy as a tool for nano-material characterization 閱讀全文 »
Humidity study of a-Si PV cell 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Humidity study of a-Si PV cell 閱讀全文 »
Circuit level interconnect reliability study using 3D circuit model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Circuit level interconnect reliability study using 3D circuit model 閱讀全文 »
Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 閱讀全文 »
Hot carrier reliability of power SOI EDNMOS 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Hot carrier reliability of power SOI EDNMOS 閱讀全文 »
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 閱讀全文 »
Addressing the challenges in solder resistance measurement for electromigration test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Addressing the challenges in solder resistance measurement for electromigration test 閱讀全文 »
Electromigration performance of through silicon via (TSV) – A modeling approach 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration performance of through silicon via (TSV) – A modeling approach 閱讀全文 »
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 閱讀全文 »
