Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk) 閱讀全文 »
Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of hydrophilicity of carbon nanotube arrays on the release rate and activity of recombinant human bone morphogenetic protein-2 閱讀全文 »
Effect of IC layout on the reliability of CMOS amplifiers 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of IC layout on the reliability of CMOS amplifiers 閱讀全文 »
Applications of multi-walled carbon nanotube (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Applications of multi-walled carbon nanotube (invited) 閱讀全文 »
Performance evaluation of covalently functionalized carbon nano-tube polymer heat sink for ultra high power LED 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Performance evaluation of covalently functionalized carbon nano-tube polymer heat sink for ultra high power LED 閱讀全文 »
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections 著作 Book Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections 閱讀全文 »
Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electrical-thermal-stress coupled-field effect in SOI and partial SOI lateral power diode 閱讀全文 »
Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Covalent functionalization of carbon nanotubes and their use in dielectric epoxy composites to improve heat dissipation 閱讀全文 »
Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
Black’s equation for today’s ULSI interconnect electromigration (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Black’s equation for today’s ULSI interconnect electromigration (invited) 閱讀全文 »
