Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 閱讀全文 »
Addressing the challenges in solder resistance measurement for electromigration test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Addressing the challenges in solder resistance measurement for electromigration test 閱讀全文 »
Electromigration performance of through silicon via (TSV) – A modeling approach 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration performance of through silicon via (TSV) – A modeling approach 閱讀全文 »
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 閱讀全文 »
Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 閱讀全文 »
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
Changing Reliability Physics of Interconnect from Micro- to Nanotechnology 著作章節 Book chapters Changing Reliability Physics of Interconnect from Micro- to Nanotechnology 閱讀全文 »
Interface fracture toughness assessment of solder joints using double cantilever beam test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Interface fracture toughness assessment of solder joints using double cantilever beam test 閱讀全文 »
Indentation size effect on the creep behavior of a SnAgCu solder 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the creep behavior of a SnAgCu solder 閱讀全文 »
