A new quality control parameter in wafer fabrication for wire bonding integrity 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new quality control parameter in wafer fabrication for wire bonding integrity 閱讀全文 »
Integrating device modeling in QFD implementation for power electronics applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Integrating device modeling in QFD implementation for power electronics applications 閱讀全文 »
Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability statistics perspective on standard wafer level electromigration accelerated test (SWEAT) 閱讀全文 »
Selection of failure time within test time interval for group reliability data analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Selection of failure time within test time interval for group reliability data analysis 閱讀全文 »
Using power diode models for circuit simulations – a comprehensive review 期刊 Journal Paper Using power diode models for circuit simulations – a comprehensive review 閱讀全文 »
Effect of BOE etching time on wire bonding qualit 期刊 Journal Paper Effect of BOE etching time on wire bonding qualit 閱讀全文 »
Thermal stress distribution in the SOI structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Thermal stress distribution in the SOI structure 閱讀全文 »
Failure analysis of bond pad metal peeling using FIB and AFM 期刊 Journal Paper Failure analysis of bond pad metal peeling using FIB and AFM 閱讀全文 »
Computerization of quality control in electronics components industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Computerization of quality control in electronics components industry 閱讀全文 »
Electronic properties of n-i-n-i doping superlattices 期刊 Journal Paper Electronic properties of n-i-n-i doping superlattices 閱讀全文 »
