Application of wigner-ville distribution in electromigration noise analysis 期刊 Journal Paper Application of wigner-ville distribution in electromigration noise analysis 閱讀全文 »
Cubic Ta diffusion barrier layers for Cu metallization 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Cubic Ta diffusion barrier layers for Cu metallization 閱讀全文 »
Characterization of a-Ta diffusion barrier for copper metallization 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Characterization of a-Ta diffusion barrier for copper metallization 閱讀全文 »
Improvement of Ta diffusion barrier by NH3 plasma pre-treatment 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Improvement of Ta diffusion barrier by NH3 plasma pre-treatment 閱讀全文 »
Novel rapid nondestructive technique for locating tiny voids in metallization line 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Novel rapid nondestructive technique for locating tiny voids in metallization line 閱讀全文 »
Diffusion studies of Cu in Si and low-k dielectric materials 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Diffusion studies of Cu in Si and low-k dielectric materials 閱讀全文 »
Reliability Data Analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability Data Analysis 閱讀全文 »
QFD implementation in a discrete semiconductor industry 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming QFD implementation in a discrete semiconductor industry 閱讀全文 »
A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 期刊 Journal Paper A reliability statistics perspective on the pitfalls of standard wafer-level electromigration accelerated test (SWEAT) 閱讀全文 »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 閱讀全文 »
