Low temperature wafer bonding process using sol-gel intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature wafer bonding process using sol-gel intermediate layer 閱讀全文 »
Current crowding effect on submicron copper dual damascene via bottom failure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Current crowding effect on submicron copper dual damascene via bottom failure 閱讀全文 »
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of current crowding on copper dual damascene via bottom failure for ULSI applications 閱讀全文 »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 閱讀全文 »
Identifying key parameters for risk based inspections (RBI) 期刊 Journal Paper Identifying key parameters for risk based inspections (RBI) 閱讀全文 »
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc 閱讀全文 »
New useful information from simple forward I-V measurement of a power diode 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming New useful information from simple forward I-V measurement of a power diode 閱讀全文 »
Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer 閱讀全文 »
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 閱讀全文 »
Industry-university R&D collaboration: expectation and reality 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Industry-university R&D collaboration: expectation and reality 閱讀全文 »
