A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 閱讀全文 »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 閱讀全文 »
Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing 著作章節 Book chapters Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing 閱讀全文 »
Stress-induced voiding study in integrated circuit interconnects 期刊 Journal Paper Stress-induced voiding study in integrated circuit interconnects 閱讀全文 »
Use of high altitude balloon platforms for small satellite testing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Use of high altitude balloon platforms for small satellite testing 閱讀全文 »
Statistical modeling of via redundancy effects on interconnect reliability 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Statistical modeling of via redundancy effects on interconnect reliability 閱讀全文 »
Humidity effect on the degradation of packaged ultra-bright white LEDs, 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Humidity effect on the degradation of packaged ultra-bright white LEDs, 閱讀全文 »
Finite element modeling of capacitive coupling voltage contrast 期刊 Journal Paper Finite element modeling of capacitive coupling voltage contrast 閱讀全文 »
An approach to statistical analysis of gate oxide breakdown mechanisms 期刊 Journal Paper An approach to statistical analysis of gate oxide breakdown mechanisms 閱讀全文 »