期刊 Journal Paper Stress-induced voiding study in integrated circuit interconnects Y. Hou and C. M. Tan. “Stress-induced voiding study in integrated circuit interconnects,” Semiconductor Science and Technology, vol.23, 2008.
期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming Investigation of the impact of Drive current and phosphor thickness on the reliability of High Power White LED lamp Bya0938724577 2019 年 6 月 25 日2021 年 4 月 12 日
期刊 Journal Paper Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications Bya0938724577 2005 年 2 月 25 日
期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming The difference between reliability engineering and reliability science ByJames 2021 年 2 月 20 日2021 年 4 月 12 日
期刊 Journal Paper | 陳効謙 Dr. Hsiao-Chien Chen Strong Correlation between the Dynamic Chemical State and Product Profile of Carbon Dioxide Electroreduction. Bycrest 2023 年 10 月 13 日2023 年 10 月 13 日
刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming Investigation of the physical processes during electromigration of ULSI interconnection (invited) Byidiotj2002dm 2003 年 1 月 1 日2021 年 4 月 14 日
期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming Humidity study of a-Si PV cell Bya0938724577 2010 年 2 月 25 日2021 年 4 月 12 日