Physics of electromigration in today ULSI interconnections (Tutorial) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Physics of electromigration in today ULSI interconnections (Tutorial) 閱讀全文 »
3D electromigration modeling at circuit level (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming 3D electromigration modeling at circuit level (Invited Talk) 閱讀全文 »
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) 閱讀全文 »
Degradation behavior of high power light emitting diode under high frequency switching 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Degradation behavior of high power light emitting diode under high frequency switching 閱讀全文 »
Comparison of electromigration simulation in test structure and actual circuit 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of electromigration simulation in test structure and actual circuit 閱讀全文 »
Reliability study of LED driver – a case study of black box testing 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Reliability study of LED driver – a case study of black box testing 閱讀全文 »
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay 閱讀全文 »
Reliability study of LED driver – a case study of black box testing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability study of LED driver – a case study of black box testing 閱讀全文 »
Degradation behaviour of high power light emitting diode under high frequency switching 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Degradation behaviour of high power light emitting diode under high frequency switching 閱讀全文 »
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 閱讀全文 »
