TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current

J. Zhang, K. Ghosh, L. Zhang, Y. Dong, H. Y. Li, C. M. Tan, G. Xia, and C. S. Tan, “TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current,” in Int. Conf. on Solid State Devices and Materials, Kyoto, Japan, 25-27th Sep. 2012.