Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of residual mechanical stress in partial SOI structure due to wafer bonding processing 閱讀全文 »
Low temperature wafer bonding in medium vacuum 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature wafer bonding in medium vacuum 閱讀全文 »
Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer 閱讀全文 »
Low temperature silicon wafer bonding by sol-gel processing 期刊 Journal Paper Low temperature silicon wafer bonding by sol-gel processing 閱讀全文 »
Silicon-to-silicon wafer bonding efficiency by sol-gel process 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Silicon-to-silicon wafer bonding efficiency by sol-gel process 閱讀全文 »
Influence of applied load on wafer bonding in vacuum 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Influence of applied load on wafer bonding in vacuum 閱讀全文 »
Influence of plasma treatment and cleaning on vacuum wafer bonding 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Influence of plasma treatment and cleaning on vacuum wafer bonding 閱讀全文 »
Low temperature silicon wafer bonding by sol-gel processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature silicon wafer bonding by sol-gel processing 閱讀全文 »
Influence of super-thin oxide layer on device fabricated on partial SOI substrate 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Influence of super-thin oxide layer on device fabricated on partial SOI substrate 閱讀全文 »
