Low temperature silicon wafer bonding by sol-gel processing

S. S. Deng, J. Wei, C. M. Tan, S. M. L. Nai, W. B. Yu, and H. Xie. “Low temperature silicon wafer bonding by sol-gel processing,” International Journal of Computational Engineering Science, vol. 4, no. 3, pp. 655-658, 2003.

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