Stress-induced voiding study in integrated circuit interconnects 期刊 Journal Paper Stress-induced voiding study in integrated circuit interconnects 閱讀全文 »
Electromigration in ULSI Interconnects 期刊 Journal Paper Electromigration in ULSI Interconnects 閱讀全文 »
Application of Gamma Distribution in Electromigration for Submicron Interconnects 期刊 Journal Paper Application of Gamma Distribution in Electromigration for Submicron Interconnects 閱讀全文 »
Lifetime modeling for stress-induced voiding in integrated circuit interconnections 期刊 Journal Paper Lifetime modeling for stress-induced voiding in integrated circuit interconnections 閱讀全文 »
Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling 期刊 Journal Paper Dynamic simulation of electromigration in polycrystalline interconnect thin film using combined Monte Carlo algorithm and finite element modeling 閱讀全文 »
Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure 期刊 Journal Paper Probing into the asymmetric nature of electromigration performance of submicron interconnect via structure 閱讀全文 »
Blech effect in Cu interconnects with oxide and low-k dielectrics 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Blech effect in Cu interconnects with oxide and low-k dielectrics 閱讀全文 »
Electromigration in ULSI Interconnection (keynote) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Electromigration in ULSI Interconnection (keynote) 閱讀全文 »
Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Enhanced finite element modelling of Cu electromigration using ANSYS and Matlab 閱讀全文 »
Revisit to the finite element modeling of electromigration for narrow interconnects 期刊 Journal Paper Revisit to the finite element modeling of electromigration for narrow interconnects 閱讀全文 »
