A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming A modified constitutive model for creep of Sn-3.5Ag-0.7Cu solder joints 閱讀全文 »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
A holistic numerical modeling for interconnect electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A holistic numerical modeling for interconnect electromigration 閱讀全文 »
Size effect in Cu nano-interconnects and its implication on electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Size effect in Cu nano-interconnects and its implication on electromigration 閱讀全文 »
Very high current density package level electromigration test for copper interconnects 期刊 Journal Paper Very high current density package level electromigration test for copper interconnects 閱讀全文 »
A bimodal 3-parameter lognormal mixture distribution for electromigration failures 期刊 Journal Paper A bimodal 3-parameter lognormal mixture distribution for electromigration failures 閱讀全文 »
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 閱讀全文 »
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 閱讀全文 »
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 閱讀全文 »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 閱讀全文 »
