Applications of Finite element Methods for Reliability Study of ULSI Interconnections 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Applications of Finite element Methods for Reliability Study of ULSI Interconnections 閱讀全文 »
Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 閱讀全文 »
Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Applications of Finite element Methods for Reliability Study of ULSI Interconnections (Invited Talk) 閱讀全文 »
Black’s equation for today’s ULSI interconnect electromigration (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Black’s equation for today’s ULSI interconnect electromigration (invited) 閱讀全文 »
Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Width dependence of the effectiveness of reservoir length in improving electromigration for Cu/low-K interconnects 閱讀全文 »
Addressing the challenges in solder resistance measurement for electromigration test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Addressing the challenges in solder resistance measurement for electromigration test 閱讀全文 »
Electromigration performance of through silicon via (TSV) – A modeling approach 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration performance of through silicon via (TSV) – A modeling approach 閱讀全文 »
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder 閱讀全文 »
Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation creep and hardness of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 閱讀全文 »
Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Ageing study of interfacial intermetallic growth in a lead-free solder reinforced with Ni-coated carbon nanotubes 閱讀全文 »
