Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Non-destructive Degradation Study of Copper Wire Bond for Its Temperature Cycling Reliability Evaluation 閱讀全文 »
Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Revisit resistance monitoring techniques for measuring TSV/Solder resistance during Electromigration test 閱讀全文 »
Extending electromigration modeling from test structures to Integrated circuit layout level 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Extending electromigration modeling from test structures to Integrated circuit layout level 閱讀全文 »
Rapid ULSI Interconnect Reliability Analysis Using Neural Networks 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Rapid ULSI Interconnect Reliability Analysis Using Neural Networks 閱讀全文 »
Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Interfacial reaction and shear strength of Ni-coated carbon nanotubes refinforced Sn-Ag-Cu solder joints during thermal cycling 閱讀全文 »
Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Integration of Low-k Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief 閱讀全文 »
Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk) 閱讀全文 »
Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay 閱讀全文 »
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 閱讀全文 »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 閱讀全文 »
