Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromagnetic Induced Failure in GaN-HEMT High Frequency Power Amplifier 閱讀全文 »
Failure Mechanisms of GaN Transistors in High Power Integrated Circuits 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Failure Mechanisms of GaN Transistors in High Power Integrated Circuits 閱讀全文 »
EOS Failure Analysis and Root Cause Identification of Schottky Barrier Rectifiers through Finite Element Modelling 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming EOS Failure Analysis and Root Cause Identification of Schottky Barrier Rectifiers through Finite Element Modelling 閱讀全文 »
Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Damage Threshold Determination and Non-destructive Identification of Possible Failure Sites in PIN Limiter 閱讀全文 »
Finite element modeling of capacitive coupling voltage contrast 期刊 Journal Paper Finite element modeling of capacitive coupling voltage contrast 閱讀全文 »
Finite element modeling of capacitive coupling voltage contrast 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of capacitive coupling voltage contrast 閱讀全文 »
Feasibility study of the application of voltage contrast to printed circuit board 期刊 Journal Paper Feasibility study of the application of voltage contrast to printed circuit board 閱讀全文 »
Mapping of solder mask covered interconnects on high density printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Mapping of solder mask covered interconnects on high density printed circuit board 閱讀全文 »
Investigation of weight-on-wheel switch failure in F-16 aircraft 期刊 Journal Paper Investigation of weight-on-wheel switch failure in F-16 aircraft 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 期刊 Journal Paper Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
