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可靠度科學技術研究中心 CREST, Chang Gung University

Devices Reliability

期刊 Journal Paper

An approach to statistical analysis of gate oxide breakdown mechanisms

Bya0938724577 2007 年 2 月 25 日

Read More An approach to statistical analysis of gate oxide breakdown mechanismsContinue

期刊 Journal Paper

Reverse breakdown voltage measurement for power P+NN+ rectifier

Byidiotj2002dm 2007 年 1 月 1 日

Read More Reverse breakdown voltage measurement for power P+NN+ rectifierContinue

期刊 Journal Paper

Device level electrical-thermal-stress coupled-field modeling

Byidiotj2002dm 2006 年 1 月 1 日

Read More Device level electrical-thermal-stress coupled-field modelingContinue

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Device level electrical-thermal-stress coupled-field modeling

Byidiotj2002dm 2006 年 1 月 1 日2021 年 4 月 14 日

Read More Device level electrical-thermal-stress coupled-field modelingContinue

期刊 Journal Paper

Reliability screening through electrical testing for press-fit alternator power diode in automotive application

Bya0938724577 2005 年 2 月 25 日

Read More Reliability screening through electrical testing for press-fit alternator power diode in automotive applicationContinue

期刊 Journal Paper

Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications

Bya0938724577 2005 年 2 月 25 日

Read More Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applicationsContinue

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Device temperature and stress distributions in power diode – a finite element method

Byidiotj2002dm 2005 年 1 月 1 日2021 年 4 月 14 日

Read More Device temperature and stress distributions in power diode – a finite element methodContinue

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Reliability screening through electrical testing for press-fit alternator power diode in automotive application

Byidiotj2002dm 2005 年 1 月 1 日2021 年 4 月 14 日

Read More Reliability screening through electrical testing for press-fit alternator power diode in automotive applicationContinue

期刊 Journal Paper

Thermally induced stress in partial SOI structure during high temperature processing

Bya0938724577 2004 年 2 月 25 日

Read More Thermally induced stress in partial SOI structure during high temperature processingContinue

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

New useful information from simple forward I-V measurement of a power diode

Byidiotj2002dm 2004 年 1 月 1 日2021 年 4 月 14 日

Read More New useful information from simple forward I-V measurement of a power diodeContinue

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標籤 Tags

Battery (15) Devices Reliability (27) Electromagnetics (10) Failure Analysis (16) General Reliability (3) Integrated Circuit Reliability (13) Interconnects Reliability (80) LED Reliability (36) Memory (1) Nanotechnology (46) Others (32) Predictive Maintenance (3) Predictive Maintenance/ Prognosis and Health Mgt (7) Prognosis and Health Mgt (16) Quality (8) Quantitative Service Reliability Assessment on Single and Multi Layer Networks (5) Radiation (7) Reliability Statistics (12) Remanufacturing (2) Theory and Practice of Quality and Reliability Engineering in Asia Industry (2) Wafer Bonding (19)

333323桃園市龜山區文化一路259號第二醫學大樓4樓
4th Floor, 2nd Medical Science Building, No.259, Wenhua 1st Rd., Guishan Dist., Taoyuan City 33302, Taiwan (R.O.C.)
TEL:886-3-2118800 ext 3872
E-Mail:crest@mail.cgu.edu.tw
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Copyright ©Center for Reliability Sciences & Technologies, Chang Gung University

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  • 首頁
  • 中心簡介
    • 主任介紹 Director
    • 主任的話 Message
    • 中心願景 Vision&Mission
    • 可靠度學程 Program
    • 獲獎 Awards
    • 組織架構 Organization
  • CReST談話
    • 中心季刊 Newsletter
    • 影像集 Album
  • 研究群
  • 實驗室核心
    • 設備 Equipment
    • 軟體 Software
    • 合作 Cooperation
  • 研究成果
  • 刊物
    • 著作 Book
    • 著作章節 Book chapters
    • 期刊 Journal Paper
    • 會議論文 Conference Paper
  • 聯絡
  • 網站導覽
  • 長庚大學
  • English
  • 中文 (台灣)
Search