Device level electrical-thermal-stress coupled-field modeling
G. Huang and C. M. Tan. “Device level electrical-thermal-stress coupled-field modeling,” Microelectronics Reliability, vol. 46, no. 9-11, pp. 1823-1827, 2006.
G. Huang and C. M. Tan. “Device level electrical-thermal-stress coupled-field modeling,” Microelectronics Reliability, vol. 46, no. 9-11, pp. 1823-1827, 2006.