Making wafer bonding viable for mass production 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Making wafer bonding viable for mass production 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
Thermal stability of Cu/α-Ta/SiO2/Si structures 期刊 Journal Paper Thermal stability of Cu/α-Ta/SiO2/Si structures 閱讀全文 »
Determining maintenance strategy from root cause analysis and reliability data analysis (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Determining maintenance strategy from root cause analysis and reliability data analysis (invited) 閱讀全文 »
Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 閱讀全文 »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 期刊 Journal Paper Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 閱讀全文 »
Influence of applied load on vacuum wafer bonding at low temperature 期刊 Journal Paper Influence of applied load on vacuum wafer bonding at low temperature 閱讀全文 »
Thermally induced stress in partial SOI structure during high temperature processing 期刊 Journal Paper Thermally induced stress in partial SOI structure during high temperature processing 閱讀全文 »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 期刊 Journal Paper Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 閱讀全文 »
Barrier layer effects on reliabilities of copper metallization 期刊 Journal Paper Barrier layer effects on reliabilities of copper metallization 閱讀全文 »
