Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 期刊 Journal Paper Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 期刊 Journal Paper Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 閱讀全文 »
Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Dynamic simulation of electromigration in polycrystalline thin film using combined Monte Carlo algorithm and finite element modeling 閱讀全文 »
Development of highly accelerated electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Development of highly accelerated electromigration test 閱讀全文 »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »
Electromigration in damascene copper interconnects of line width down to 100 nm 期刊 Journal Paper Electromigration in damascene copper interconnects of line width down to 100 nm 閱讀全文 »
Development of highly accelerated electromigration test 期刊 Journal Paper Development of highly accelerated electromigration test 閱讀全文 »
Device level electrical-thermal-stress coupled-field modeling 期刊 Journal Paper Device level electrical-thermal-stress coupled-field modeling 閱讀全文 »
Mapping of solder mask covered interconnects on high density printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Mapping of solder mask covered interconnects on high density printed circuit board 閱讀全文 »
Device level electrical-thermal-stress coupled-field modeling 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Device level electrical-thermal-stress coupled-field modeling 閱讀全文 »
