Degradation behaviour of high power light emitting diode under high frequency switching 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Degradation behaviour of high power light emitting diode under high frequency switching 閱讀全文 »
TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming TSV scaling with constant liner thickness and the related implications on thermo-mechanical stress, capacitance, and leakage current 閱讀全文 »
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints 閱讀全文 »
Recent Development of Reliability and Maintenance (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Recent Development of Reliability and Maintenance (Invited Talk) 閱讀全文 »
Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test 閱讀全文 »
Effect of IC layout on the reliability of CMOS amplifiers 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of IC layout on the reliability of CMOS amplifiers 閱讀全文 »
Applications of Finite element Methods for Reliability Study of ULSI Interconnections 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Applications of Finite element Methods for Reliability Study of ULSI Interconnections 閱讀全文 »
ICMAT 2011 – Reliability and variability of semiconductor devices and ICs 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming ICMAT 2011 – Reliability and variability of semiconductor devices and ICs 閱讀全文 »
Study of humidity reliability of solid state lighting (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Study of humidity reliability of solid state lighting (Invited Talk) 閱讀全文 »
Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Creep mitigation in Sn-Ag-Cu composite solder with Ni-coated carbon nanotubes 閱讀全文 »
