Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 期刊 Journal Paper Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 閱讀全文 »
Overcoming intrinsic weakness of ULSI metallization electromigration performances 期刊 Journal Paper Overcoming intrinsic weakness of ULSI metallization electromigration performances 閱讀全文 »
Identifying key parameters for risk based inspections (RBI) 期刊 Journal Paper Identifying key parameters for risk based inspections (RBI) 閱讀全文 »
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc 閱讀全文 »
Non-destructive void size determination in copper metallization under passivation 期刊 Journal Paper Non-destructive void size determination in copper metallization under passivation 閱讀全文 »
Temperature and stress distribution in the SOI structure during fabrication 期刊 Journal Paper Temperature and stress distribution in the SOI structure during fabrication 閱讀全文 »
A new method for deposition of cubic Ta diffusion barrier for Cu metallization 期刊 Journal Paper A new method for deposition of cubic Ta diffusion barrier for Cu metallization 閱讀全文 »
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 期刊 Journal Paper Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 閱讀全文 »
Low temperature silicon wafer bonding by sol-gel processing 期刊 Journal Paper Low temperature silicon wafer bonding by sol-gel processing 閱讀全文 »
Methodology for customer’s focus build-in reliability 期刊 Journal Paper Methodology for customer’s focus build-in reliability 閱讀全文 »
