Mechanism of sol-gel intermediate layer low temperature wafer bonding 期刊 Journal Paper Mechanism of sol-gel intermediate layer low temperature wafer bonding 閱讀全文 »
Study of carbon in thermal oxide formed on 4H-SiC by XPS 期刊 Journal Paper Study of carbon in thermal oxide formed on 4H-SiC by XPS 閱讀全文 »
Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 閱讀全文 »
Thermal stability of Cu/α-Ta/SiO2/Si structures 期刊 Journal Paper Thermal stability of Cu/α-Ta/SiO2/Si structures 閱讀全文 »
Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 閱讀全文 »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 期刊 Journal Paper Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 閱讀全文 »
Influence of applied load on vacuum wafer bonding at low temperature 期刊 Journal Paper Influence of applied load on vacuum wafer bonding at low temperature 閱讀全文 »
Thermally induced stress in partial SOI structure during high temperature processing 期刊 Journal Paper Thermally induced stress in partial SOI structure during high temperature processing 閱讀全文 »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 期刊 Journal Paper Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 閱讀全文 »
Barrier layer effects on reliabilities of copper metallization 期刊 Journal Paper Barrier layer effects on reliabilities of copper metallization 閱讀全文 »
