Unveiling the electromigration physics of ULSI interconnects through statistics 期刊 Journal Paper Unveiling the electromigration physics of ULSI interconnects through statistics 閱讀全文 »
Feasibility study of the application of voltage contrast to printed circuit board 期刊 Journal Paper Feasibility study of the application of voltage contrast to printed circuit board 閱讀全文 »
Low temperature sol-gel intermediate layer wafer bonding 期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding 閱讀全文 »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 期刊 Journal Paper Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 閱讀全文 »
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification 期刊 Journal Paper Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification 閱讀全文 »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 期刊 Journal Paper Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 期刊 Journal Paper Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 閱讀全文 »
Electromigration in damascene copper interconnects of line width down to 100 nm 期刊 Journal Paper Electromigration in damascene copper interconnects of line width down to 100 nm 閱讀全文 »
Development of highly accelerated electromigration test 期刊 Journal Paper Development of highly accelerated electromigration test 閱讀全文 »
Device level electrical-thermal-stress coupled-field modeling 期刊 Journal Paper Device level electrical-thermal-stress coupled-field modeling 閱讀全文 »
