3D circuit model for 3D IC reliability study (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming 3D circuit model for 3D IC reliability study (invited) 閱讀全文 »
A holistic numerical modeling for interconnect electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A holistic numerical modeling for interconnect electromigration 閱讀全文 »
Size effect in Cu nano-interconnects and its implication on electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Size effect in Cu nano-interconnects and its implication on electromigration 閱讀全文 »
Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications 閱讀全文 »
Methodologies for size, and temperature dependent change of materials properties 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Methodologies for size, and temperature dependent change of materials properties 閱讀全文 »
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 閱讀全文 »
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 閱讀全文 »
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 閱讀全文 »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 閱讀全文 »
Use of high altitude balloon platforms for small satellite testing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Use of high altitude balloon platforms for small satellite testing 閱讀全文 »
