期刊 Journal Paper Mechanism of sol-gel intermediate layer low temperature wafer bonding Byidiotj2002dm 2005 年 1 月 1 日
期刊 Journal Paper Study of carbon in thermal oxide formed on 4H-SiC by XPS Byidiotj2002dm 2005 年 1 月 1 日
期刊 Journal Paper Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc Byidiotj2002dm 2005 年 1 月 1 日
期刊 Journal Paper Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc Bya0938724577 2004 年 2 月 25 日
期刊 Journal Paper Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology Bya0938724577 2004 年 2 月 25 日
期刊 Journal Paper Influence of applied load on vacuum wafer bonding at low temperature Bya0938724577 2004 年 2 月 25 日
期刊 Journal Paper Thermally induced stress in partial SOI structure during high temperature processing Bya0938724577 2004 年 2 月 25 日
期刊 Journal Paper Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects Bya0938724577 2004 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper Barrier layer effects on reliabilities of copper metallization Bya0938724577 2004 年 2 月 25 日2021 年 3 月 4 日
