期刊 Journal Paper Unveiling the electromigration physics of ULSI interconnects through statistics Byidiotj2002dm 2007 年 1 月 1 日
期刊 Journal Paper Feasibility study of the application of voltage contrast to printed circuit board Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification Bya0938724577 2006 年 2 月 25 日
期刊 Journal Paper Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect Bya0938724577 2006 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects Bya0938724577 2006 年 2 月 25 日2021 年 3 月 4 日
期刊 Journal Paper Electromigration in damascene copper interconnects of line width down to 100 nm Byidiotj2002dm 2006 年 1 月 1 日
期刊 Journal Paper Development of highly accelerated electromigration test Byidiotj2002dm 2006 年 1 月 1 日
期刊 Journal Paper Device level electrical-thermal-stress coupled-field modeling Byidiotj2002dm 2006 年 1 月 1 日
