Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures 期刊 Journal Paper Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures 閱讀全文 »
Current crowding effect on copper dual damascene via bottom failure for ULSI applications 期刊 Journal Paper Current crowding effect on copper dual damascene via bottom failure for ULSI applications 閱讀全文 »
Thermal stability of Cu/α-Ta/SiO2/Si structures 期刊 Journal Paper Thermal stability of Cu/α-Ta/SiO2/Si structures 閱讀全文 »
Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Intrinsic mechanical properties of diamond-like carbon thin films deposited by filtered cathodic vacuum arc 閱讀全文 »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 期刊 Journal Paper Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 閱讀全文 »
Influence of applied load on vacuum wafer bonding at low temperature 期刊 Journal Paper Influence of applied load on vacuum wafer bonding at low temperature 閱讀全文 »
Thermally induced stress in partial SOI structure during high temperature processing 期刊 Journal Paper Thermally induced stress in partial SOI structure during high temperature processing 閱讀全文 »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 期刊 Journal Paper Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 閱讀全文 »
Barrier layer effects on reliabilities of copper metallization 期刊 Journal Paper Barrier layer effects on reliabilities of copper metallization 閱讀全文 »
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 期刊 Journal Paper Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 閱讀全文 »
