Atomic drift-less electromigration model for submicron copper interconnects.

Adhikari, Aparna, Arijit Roy, and Cher Ming Tan. “Atomic drift-less electromigration model for submicron copper interconnects.” VOLUME 21 : ISSUE 7 (July) – 2022

Atomic-drift-less-electromigration-model-for-submicron-copper-interconnects.pdf (researchgate.net)