A new method for deposition of cubic Ta diffusion barrier for Cu metallization 期刊 Journal Paper A new method for deposition of cubic Ta diffusion barrier for Cu metallization 閱讀全文 »
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 期刊 Journal Paper Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 閱讀全文 »
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 閱讀全文 »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 閱讀全文 »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Investigation of the physical processes during electromigration of ULSI interconnection (invited) 閱讀全文 »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 閱讀全文 »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Overcoming intrinsic weakness of ULSI metallization on electromigration performances 閱讀全文 »
Low temperature silicon wafer bonding by sol-gel processing 期刊 Journal Paper Low temperature silicon wafer bonding by sol-gel processing 閱讀全文 »
Methodology for customer’s focus build-in reliability 期刊 Journal Paper Methodology for customer’s focus build-in reliability 閱讀全文 »
A novel technique to re-construct three dimensional void in passivated metal interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A novel technique to re-construct three dimensional void in passivated metal interconnects 閱讀全文 »
