Investigation of the reliability of nano-nickel/niobium oxide-based multilayer thin films deposited on polymer substrates for flexible electronic applications.
Sahay, R., Tu, Y. C., Aziz, I., Budiman, A. S., Tan, C.
Root Cause Analysis of a Printed Circuit Board (PCB) Failure in a Public Transport Communication System.
Tan, C. M., Chen, H. H., Wu, J. P., Sangwan, V., Tsai,
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.
Tan, Cher-Ming. “Editorial for Special Issue on R
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices. 閱讀全文 »
Atomic drift-less electromigration model for submicron copper interconnects.
Adhikari, Aparna, Arijit Roy, and Cher Ming Tan. “
Atomic drift-less electromigration model for submicron copper interconnects. 閱讀全文 »
2022年度「全球前 2% 頂尖科學家與終身成就」陳始明教授
2022年度「全球前2%頂尖科學家榜單（World’s Top 2% Scientists）」於2
2022年度「全球前 2% 頂尖科學家與終身成就」陳始明教授 閱讀全文 »