Application of FMEA for build-in reliability and maintenance (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Application of FMEA for build-in reliability and maintenance (invited) 閱讀全文 »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 閱讀全文 »
Non-destructive void size determination in copper metallization under passivation 期刊 Journal Paper Non-destructive void size determination in copper metallization under passivation 閱讀全文 »
Temperature and stress distribution in the SOI structure during fabrication 期刊 Journal Paper Temperature and stress distribution in the SOI structure during fabrication 閱讀全文 »
A new method for deposition of cubic Ta diffusion barrier for Cu metallization 期刊 Journal Paper A new method for deposition of cubic Ta diffusion barrier for Cu metallization 閱讀全文 »
Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 期刊 Journal Paper Failure mechanisms of aluminum bond pad peeling during thermosonic bonding 閱讀全文 »
Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 閱讀全文 »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 閱讀全文 »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Investigation of the physical processes during electromigration of ULSI interconnection (invited) 閱讀全文 »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 閱讀全文 »
