Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 期刊 Journal Paper Mechanical properties of Zirconia Thin Films deposited by filtered cathodic vacuum arc 閱讀全文 »
Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 閱讀全文 »
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 閱讀全文 »
Examine the impact of maintenance policy for predictive maintenance 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Examine the impact of maintenance policy for predictive maintenance 閱讀全文 »
New analysis technique for time to failure data in copper electromigration 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming New analysis technique for time to failure data in copper electromigration 閱讀全文 »
Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of high voltage annealing on the field emission of multi-walled carbon nanotube film 閱讀全文 »
Device temperature and stress distributions in power diode – a finite element method 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Device temperature and stress distributions in power diode – a finite element method 閱讀全文 »
Reliability screening through electrical testing for press-fit alternator power diode in automotive application 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability screening through electrical testing for press-fit alternator power diode in automotive application 閱讀全文 »
Making wafer bonding viable for mass production 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Making wafer bonding viable for mass production 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
