Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 閱讀全文 »
Room temperature observation of point defect on gold surface using thermovoltage mapping 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Room temperature observation of point defect on gold surface using thermovoltage mapping 閱讀全文 »
Statistical analysis of multi-censored electromigration data using the EM algorithm 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Statistical analysis of multi-censored electromigration data using the EM algorithm 閱讀全文 »
An approach to statistical analysis of gate oxide breakdown mechanisms 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming An approach to statistical analysis of gate oxide breakdown mechanisms 閱讀全文 »
Feasibility study of the application of voltage contrast to printed circuit board 期刊 Journal Paper Feasibility study of the application of voltage contrast to printed circuit board 閱讀全文 »
Low temperature sol-gel intermediate layer wafer bonding 期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding 閱讀全文 »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 期刊 Journal Paper Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 閱讀全文 »
Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification 期刊 Journal Paper Change in thermal conductivity of cylindrical silicon nanowires induced by surface bonding modification 閱讀全文 »
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 期刊 Journal Paper Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect 閱讀全文 »
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 期刊 Journal Paper Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects 閱讀全文 »
