Very high current density package level electromigration test for copper interconnects 期刊 Journal Paper Very high current density package level electromigration test for copper interconnects 閱讀全文 »
A bimodal 3-parameter lognormal mixture distribution for electromigration failures 期刊 Journal Paper A bimodal 3-parameter lognormal mixture distribution for electromigration failures 閱讀全文 »
Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of Electromigration in ULSI Interconnections and in solder bumpings of a package system 閱讀全文 »
The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming The multiple temperature heater platforms for solder Electromigration test conducted at room temperature 閱讀全文 »
A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress 閱讀全文 »
Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Fracture Toughness Assessment of a solder joint using double cantilever beam specimens 閱讀全文 »
Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing 著作章節 Book chapters Simulated Annealing for Mixture Distribution Analysis and its Applications to Reliability Testing 閱讀全文 »
Stress-induced voiding study in integrated circuit interconnects 期刊 Journal Paper Stress-induced voiding study in integrated circuit interconnects 閱讀全文 »
Use of high altitude balloon platforms for small satellite testing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Use of high altitude balloon platforms for small satellite testing 閱讀全文 »
