Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electrowetting control of cassie-to-wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites 閱讀全文 »
Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Dynamic simulation of void nucleation during electromigration in narrow integrated circuit interconnects 閱讀全文 »
Electromigration in width transition copper interconnect 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration in width transition copper interconnect 閱讀全文 »
Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 閱讀全文 »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 閱讀全文 »
Indentation size effect on the hardness of a Sn-Ag-Cu Solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the hardness of a Sn-Ag-Cu Solder 閱讀全文 »
Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 閱讀全文 »
Requirement for accurate interconnect temperature measurement for Electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Requirement for accurate interconnect temperature measurement for Electromigration test 閱讀全文 »
Reliability Assessment of Integrated Circuits and its Misconception 著作 Book Reliability Assessment of Integrated Circuits and its Misconception 閱讀全文 »
Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 閱讀全文 »
