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    可靠度科學技術研究中心 CREST, Chang Gung University
    • 首頁
    • 中心簡介
      • 主任介紹 Director
      • 主任的話 Message
      • 中心願景 Vision&Mission
      • 可靠度學程 Program
      • 獲獎 Awards
      • 組織架構 Organization
    • CReST談話
      • 中心季刊 Newsletter
      • 影像集 Album
    • 研究群
    • 實驗室核心
      • 設備 Equipment
      • 軟體 Software
      • 合作 Cooperation
    • 研究成果
    • 刊物
      • 著作 Book
      • 著作章節 Book chapters
      • 期刊 Journal Paper
      • 會議論文 Conference Paper
    • 聯絡
    • 網站導覽
    • 長庚大學
    • English
    • 中文 (台灣)
  • 長庚大學
    • English

    Multifunctions of excited gold nanoparticles decorated artificial kidney with efficient hemodialysis and therapeutic potential.

    期刊 Journal Paper, 陳効謙 Dr. Hsiao-Chien Chen

    Multifunctions of excited gold nanoparticles decorated artificial kidney with efficient hemodialysis and therapeutic potential. 閱讀全文 »

    A review on the humidity reliability of high power white light LEDs

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    A review on the humidity reliability of high power white light LEDs 閱讀全文 »

    Early degradation of high power packaged LEDs under humid conditions and its recovery — Myth of reliability rejuvenation

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Early degradation of high power packaged LEDs under humid conditions and its recovery — Myth of reliability rejuvenation 閱讀全文 »

    Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules 閱讀全文 »

    Copper induced synthesis of graphene using amorphous carbon

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Copper induced synthesis of graphene using amorphous carbon 閱讀全文 »

    Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation

    期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming

    Non-destructive degradation study of copper wire bond for its temperature cycling reliability evaluation 閱讀全文 »

    Triggering comprehensive enhancement in oxygen evolution reaction by using newly created solvent.

    期刊 Journal Paper, 陳効謙 Dr. Hsiao-Chien Chen

    Triggering comprehensive enhancement in oxygen evolution reaction by using newly created solvent. 閱讀全文 »

    Simulation of EMI at Design Level for Integrated Circuits

    刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming

    Simulation of EMI at Design Level for Integrated Circuits 閱讀全文 »

    Determination of key factors for low temperature graphene synthesis using design of experiments approach

    刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming

    Determination of key factors for low temperature graphene synthesis using design of experiments approach 閱讀全文 »

    Graphene as a buffer layer for high quality GaN deposition on substrates in electronics

    刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming

    Graphene as a buffer layer for high quality GaN deposition on substrates in electronics 閱讀全文 »

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    • 中心公告
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        • 陳始明 Dr. Tan, Cher Ming
        • 高瑄苓 Dr. Kao,Hsuan-Ling
        • 李坤穆 Dr. Kun-Mu Lee
        • 陳効謙 Dr. Hsiao-Chien Chen
      • 期刊 Journal Paper
        • 陳始明 Dr. Tan, Cher Ming
        • 高瑄苓 Dr. Kao,Hsuan-Ling
        • 李坤穆 Dr. Kun-Mu Lee
        • 趙自強 Dr. Chao TC
        • 陳効謙 Dr. Hsiao-Chien Chen
      • 著作章節 Book chapters
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    近期文章 Recent Posts

    • Newsletter No.9 Jul. 2025
    • 恭賀陳始明教授連續5年榮獲「全球前2%頂尖科學家榜單」殊榮
    • Newsletter No.8 Mar.2024
    • 影片導覽 Video
    • 2023.09.05 臺灣可靠度協會籌備會

    標籤 Tags

    Battery (15) Devices Reliability (27) Electromagnetics (10) Failure Analysis (16) General Reliability (3) Integrated Circuit Reliability (13) Interconnects Reliability (80) LED Reliability (36) Memory (1) Nanotechnology (46) Others (32) Predictive Maintenance (3) Predictive Maintenance/ Prognosis and Health Mgt (7) Prognosis and Health Mgt (16) Quality (8) Quantitative Service Reliability Assessment on Single and Multi Layer Networks (5) Radiation (7) Reliability Statistics (12) Remanufacturing (2) Theory and Practice of Quality and Reliability Engineering in Asia Industry (2) Wafer Bonding (19)

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