Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder

Y.D. Han*, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, J. Wei, 2010, February, “Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder,”  Journal of Electronic Materials, v 39, n 2, p 223-229.