Low temperature sol-gel intermediate layer wafer bonding 期刊 Journal Paper Low temperature sol-gel intermediate layer wafer bonding 閱讀全文 »
Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 期刊 Journal Paper Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding 閱讀全文 »
Mathematical model for low-temperature wafer bonding under medium vacuum and its application 期刊 Journal Paper Mathematical model for low-temperature wafer bonding under medium vacuum and its application 閱讀全文 »
Effect of medium vacuum on low temperature wafer bonding 期刊 Journal Paper Effect of medium vacuum on low temperature wafer bonding 閱讀全文 »
Mechanism of sol-gel intermediate layer low temperature wafer bonding 期刊 Journal Paper Mechanism of sol-gel intermediate layer low temperature wafer bonding 閱讀全文 »
Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature 閱讀全文 »
Making wafer bonding viable for mass production 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Making wafer bonding viable for mass production 閱讀全文 »
Influence of applied load on vacuum wafer bonding at low temperature 期刊 Journal Paper Influence of applied load on vacuum wafer bonding at low temperature 閱讀全文 »
Low temperature wafer bonding process using sol-gel intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature wafer bonding process using sol-gel intermediate layer 閱讀全文 »
Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Low temperature Si-to-Si wafer bonding with Sol-Gel coating as intermediate layer 閱讀全文 »
