Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Comparison of the time-dependent physical processes in the electromigration of deep submicron copper and aluminum interconnects 閱讀全文 »
Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of temperature uniformity of hot chuck on wafer level reliability electromigration test 閱讀全文 »
Investigation of the physical processes during electromigration of ULSI interconnection (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Investigation of the physical processes during electromigration of ULSI interconnection (invited) 閱讀全文 »
Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effects of Cu surface cleanness on electromigration reliability of Cu interconnects 閱讀全文 »
Overcoming intrinsic weakness of ULSI metallization on electromigration performances 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Overcoming intrinsic weakness of ULSI metallization on electromigration performances 閱讀全文 »
Cubic Ta diffusion barrier layers for Cu metallization 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Cubic Ta diffusion barrier layers for Cu metallization 閱讀全文 »
Characterization of a-Ta diffusion barrier for copper metallization 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Characterization of a-Ta diffusion barrier for copper metallization 閱讀全文 »
Improvement of Ta diffusion barrier by NH3 plasma pre-treatment 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Improvement of Ta diffusion barrier by NH3 plasma pre-treatment 閱讀全文 »
Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Uncover the diffusion mechanism of atoms during electromigration test using non-stationary noise analysis 閱讀全文 »
Analysis of electromigration test data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Analysis of electromigration test data 閱讀全文 »
