Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Extrapolation of electromigration reliability assessment from accelerated test for submicron interconnect via structure 閱讀全文 »
Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of vacuum break after the barrier layer deposition on the electromigratioin performance of aluminum based line interconnects 閱讀全文 »
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via structures 閱讀全文 »
Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 期刊 Journal Paper Dynamics Study of the physical processes in the Intrinsic line electromigration of deep-submicron copper and aluminum interconnects 閱讀全文 »
Barrier layer effects on reliabilities of copper metallization 期刊 Journal Paper Barrier layer effects on reliabilities of copper metallization 閱讀全文 »
Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 期刊 Journal Paper Study of Interactions between a-Ta films and SiO2 under rapid thermal annealing 閱讀全文 »
Overcoming intrinsic weakness of ULSI metallization electromigration performances 期刊 Journal Paper Overcoming intrinsic weakness of ULSI metallization electromigration performances 閱讀全文 »
Current crowding effect on submicron copper dual damascene via bottom failure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Current crowding effect on submicron copper dual damascene via bottom failure 閱讀全文 »
Effect of current crowding on copper dual damascene via bottom failure for ULSI applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of current crowding on copper dual damascene via bottom failure for ULSI applications 閱讀全文 »
Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability improvement in Al metallization: a combination of statistical prediction and failure analytical methodology 閱讀全文 »
