Interface fracture toughness assessment of solder joints using double cantilever beam test 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Interface fracture toughness assessment of solder joints using double cantilever beam test 閱讀全文 »
Indentation size effect on the creep behavior of a SnAgCu solder 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the creep behavior of a SnAgCu solder 閱讀全文 »
Electromigration in width transition copper interconnect 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration in width transition copper interconnect 閱讀全文 »
Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the creep behavior of a Sn-Ag-Cu solder 閱讀全文 »
Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Nanomechanical properties of a Sn-Ag-Cu solder reinforced with Ni coated carbon nanotubes 閱讀全文 »
Indentation size effect on the hardness of a Sn-Ag-Cu Solder 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Indentation size effect on the hardness of a Sn-Ag-Cu Solder 閱讀全文 »
Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Enhancing the properties of a Lead-free solder with the addition of Ni coated carbon nanotubes 閱讀全文 »
Requirement for accurate interconnect temperature measurement for Electromigration test 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Requirement for accurate interconnect temperature measurement for Electromigration test 閱讀全文 »
Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of stress-induced voiding phenomena in copper line-via structures with different dielectric materials 閱讀全文 »
Review of electromigration modeling of IC Interconnects 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Review of electromigration modeling of IC Interconnects 閱讀全文 »
