Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model 閱讀全文 »
3D circuit model for 3D IC reliability study (invited) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming 3D circuit model for 3D IC reliability study (invited) 閱讀全文 »
Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Predicting Integrated Circuit Reliability from Wafer Fabrication Technology Reliability Data 閱讀全文 »
