3D simulation-based research on the effect of interconnect structures on circuit reliability 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming 3D simulation-based research on the effect of interconnect structures on circuit reliability 閱讀全文 »
Physics of electromigration in today ULSI interconnections (Tutorial) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Physics of electromigration in today ULSI interconnections (Tutorial) 閱讀全文 »
3D electromigration modeling at circuit level (Invited Talk) 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming 3D electromigration modeling at circuit level (Invited Talk) 閱讀全文 »
Comparison of electromigration simulation in test structure and actual circuit 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Comparison of electromigration simulation in test structure and actual circuit 閱讀全文 »
Reliability study of LED driver – a case study of black box testing 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Reliability study of LED driver – a case study of black box testing 閱讀全文 »
Reliability study of LED driver – a case study of black box testing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Reliability study of LED driver – a case study of black box testing 閱讀全文 »
Effect of IC layout on the reliability of CMOS amplifiers 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Effect of IC layout on the reliability of CMOS amplifiers 閱讀全文 »
Electromigration reliability of interconnections in RF low noise amplifier circuit 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Electromigration reliability of interconnections in RF low noise amplifier circuit 閱讀全文 »
Effect of IC layout on the reliability of CMOS amplifiers 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effect of IC layout on the reliability of CMOS amplifiers 閱讀全文 »
Circuit level interconnect reliability study using 3D circuit model 期刊 Journal Paper, 陳始明 Dr. Tan, Cher Ming Circuit level interconnect reliability study using 3D circuit model 閱讀全文 »
