Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Feasibility of capacitive coupling voltage contrast (CCVC) for the failure analysis of advanced printed circuit board 閱讀全文 »
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist 閱讀全文 »
Non-destructive void size determination in copper metallization under passivation 期刊 Journal Paper Non-destructive void size determination in copper metallization under passivation 閱讀全文 »
A novel technique to re-construct three dimensional void in passivated metal interconnects 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming A novel technique to re-construct three dimensional void in passivated metal interconnects 閱讀全文 »
Novel rapid nondestructive technique for locating tiny voids in metallization line 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Novel rapid nondestructive technique for locating tiny voids in metallization line 閱讀全文 »
Failure analysis of bond pad metal peeling using FIB and AFM 期刊 Journal Paper Failure analysis of bond pad metal peeling using FIB and AFM 閱讀全文 »
