Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications 閱讀全文 »
Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Finite element modeling of internal mechanical stress in partial SOI structure during wafer bonding processing 閱讀全文 »
Temperature and stress distribution in the SOI structure during fabrication 期刊 Journal Paper Temperature and stress distribution in the SOI structure during fabrication 閱讀全文 »
Improving the reverse blocking capability of carrier stored trench-gate bipolar transistor 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Improving the reverse blocking capability of carrier stored trench-gate bipolar transistor 閱讀全文 »
Effectiveness of delta VF test to detect solder integrity in power diode 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Effectiveness of delta VF test to detect solder integrity in power diode 閱讀全文 »
Using power diode models for circuit simulations – a comprehensive review 期刊 Journal Paper Using power diode models for circuit simulations – a comprehensive review 閱讀全文 »
Thermal stress distribution in the SOI structure 刊物 Publication, 會議論文 Conference Paper, 陳始明 Dr. Tan, Cher Ming Thermal stress distribution in the SOI structure 閱讀全文 »
