Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature

J. Wei, S.S. Deng, C.M. Tan, “Sol-gel coating facilitating Si-to-Si wafer bonding at low temperature,” in  American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v 5, p 225-229, 2005, Electronic and Photonic Packaging, Integration and Packaging of Micro/Nano/Electronic Systems – 2005