Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer
S. S. Deng, J. Wei, C. M. Tan, and W. B. Yu. “Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer,” in Thin Film and Nanotech, 2004.
S. S. Deng, J. Wei, C. M. Tan, and W. B. Yu. “Silicon-to-silicon wafer bonding by tempered sol-gel intermediate layer,” in Thin Film and Nanotech, 2004.
