刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Reliabiilty Analysis and Application with MATLAB (invited)

C. M. Tan. “Reliabiilty Analysis and Application with MATLAB (invited),” presented at Industrial seminar, May 2004.

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Effectiveness of Reservoir Length on Electromigration lifetime enhancement for ULSI Interconnects with advanced technology nodes (Invited Talk)

Byidiotj2002dm 2012 年 11 月 1 日2021 年 4 月 14 日

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

A new creep model for Sn-Ag-Cu lead-free composite solders: incorporating back stress

Byidiotj2002dm 2008 年 1 月 1 日2021 年 4 月 14 日

期刊 Journal Paper | 陳効謙 Dr. Hsiao-Chien Chen

Polypyrrole electrode with a greater electroactive surface electrochemically polymerized in plasmon-activated water.

ByJames 2017 年 11 月 15 日2021 年 4 月 13 日

期刊 Journal Paper | 陳始明 Dr. Tan, Cher Ming

Development of Cu-based ternary nanocrystalline chalcogenides using mechanical alloying and their characterization.

Bycrest 2023 年 10 月 13 日2023 年 10 月 13 日

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect

Byidiotj2002dm 2006 年 1 月 1 日2021 年 4 月 14 日

刊物 Publication | 會議論文 Conference Paper | 陳始明 Dr. Tan, Cher Ming

Application of FTIR for the study of functional molecules grafting on carbon nanotubes

Byidiotj2002dm 2009 年 5 月 1 日2021 年 4 月 14 日